CAJ | 학술논문

电路板可靠性评估是每个制造厂家、客户研究得最多的课题，互联应力测试及冷热循环测试是现有的在短时间内评估电路板的长期可靠性的有效测试方法。文章对互联应力测试及冷热循环测试方法及标准进行了详细介绍，并通过简单的实际测试研究案例来介绍如何分析失效并找出失效原因，并提出一些失效原因的改善方向。
전로판가고성평고시매개제조엄가、객호연구득최다적과제，호련응력측시급랭열순배측시시현유적재단시간내평고전로판적장기가고성적유효측시방법。문장대호련응력측시급랭열순배측시방법급표준진행료상세개소，병통과간단적실제측시연구안례래개소여하분석실효병조출실효원인，병제출일사실효원인적개선방향。
PCB reliability testing is the most frequent subject the manufacturers and costumers devoted into. Intercenect stress test(IST)and thermal cycle test(TCT)are two of the most polular and effective test methods for evaluating the reliability of PCB in long term application within shot testing time. This paper introduce the test method and standard of IST and TCT, and presentate how to analysis test failures by introducing some study cases the auther have devoted into, and also recommend some improve dicection for IST and TCT failures.