CAJ | 학술논문

采用不同类型半固化片设计出多种叠层结构，考察其对高速PCB耐热可靠性的影响，发现扁平玻布（1067、2313等）耐热可靠性较差，无法满足客户无铅焊接要求。同时从理论上分析发现，在耐热可靠性测试过程中，扁平玻布半固化片内应力大和浸胶不完全是引起半固化片分层的主要原因。在生产设计过程中，有耐热可靠性要求的板应禁止或减少扁平玻布半固化片的使用。
채용불동류형반고화편설계출다충첩층결구，고찰기대고속PCB내열가고성적영향，발현편평파포（1067、2313등）내열가고성교차，무법만족객호무연한접요구。동시종이론상분석발현，재내열가고성측시과정중，편평파포반고화편내응력대화침효불완전시인기반고화편분층적주요원인。재생산설계과정중，유내열가고성요구적판응금지혹감소편평파포반고화편적사용。
Some stackups were designed by varies types of fabrics and its’ thermal reliabilities were investigated. It showed that MS fabrics 1067 2113 etc. couldn’t satisfy customers’ lead free requirement due to its’ poor thermal reliabilities. For the further, we analyzed the inner-stress and dimensional change during the thermal reliability tests, and found that high inner-stress and incompletely glue-dip of MS fabric were the main reasons of prepreg delamination. Therefore, MS fabrics should be forbidden or used less in stackup design to meet the thermal reliability requirement.