CAJ | 학술논문

随着电子技术发展，电路板的应用领域不断扩展，由于银的良好导电性能，使得PCB表面处理对化学银越来越受到青睐。文章分析了影响化学银剥离的主要因素，分别从生产药水、设备及铜面粗糙度等方面进行了排查分析，从而得出导致化学银剥离的根本原因，并从工艺上提出了解决方案，建立了预防及改善的措施，降低了缺陷风险。
수착전자기술발전，전로판적응용영역불단확전，유우은적량호도전성능，사득PCB표면처리대화학은월래월수도청래。문장분석료영향화학은박리적주요인소，분별종생산약수、설비급동면조조도등방면진행료배사분석，종이득출도치화학은박리적근본원인，병종공예상제출료해결방안，건립료예방급개선적조시，강저료결함풍험。
With the development of electronic technology, the application areas of circuit board is expanding. Immersion Silver Ag is more and more popular in surface treatment of circuit board because of its good conductivity. This paper analyzes the main factors affecting of Immersion Silver Ag stripping, respectively investigation from production of liquid medicine, equipment, and surface roughness of copper, thus the primary cause of Immersion Silver Ag stripping is concluded, and the solution is proposed in the process, therefore, the prevention and improvement measures are established, and the risk of defects are reduced.