CAJ | 학술논문

PCB电镀参数最终决定成品的铜厚，一般情况下，全板电镀成品的铜厚与药水深镀能力、产品尺寸、电镀设备效率息息相关。与此同时，产品孔密度分布同样对最终电镀完成铜厚有很大的影响，本文将从PCB孔密度分布的要素展开分析，从而阐述不同孔密度分布对电镀的影响。
PCB전도삼수최종결정성품적동후，일반정황하，전판전도성품적동후여약수심도능력、산품척촌、전도설비효솔식식상관。여차동시，산품공밀도분포동양대최종전도완성동후유흔대적영향，본문장종PCB공밀도분포적요소전개분석，종이천술불동공밀도분포대전도적영향。
PCB plating parameters will determine the product finished copper thickness, under normal circumstances, electroplating products full board finished copper thickness and drops TP ability, product size, electroplating equipment efifciency are closely related to. At the same time, hole density distribution also copper thickness have great impact on the final plating is completed, this paper will analyze from PCB hole density distribution of the elements, which explains the different hole density effects on electroplating.