CAJ | 학술논문

为了解决超大规模集成电路布线复杂的问题，无线互连技术(WIT)应运而生。介绍了实现芯片内/间无线互连的两类技术，一类是基于片上天线的无线互连技术，另一类是基于 AC 耦合的无线互连技术。从实现成本、功耗，传输性能方面对这两类技术进行了分析与比较，讨论了它们的具体应用及适用范围，同时也总结了两者目前存在的问题，并指出了其未来的研究方向，对今后芯片内/间无线互连技术的应用研究具有一定的参考意义。
위료해결초대규모집성전로포선복잡적문제，무선호련기술(WIT)응운이생。개소료실현심편내/간무선호련적량류기술，일류시기우편상천선적무선호련기술，령일류시기우 AC 우합적무선호련기술。종실현성본、공모，전수성능방면대저량류기술진행료분석여비교，토론료타문적구체응용급괄용범위，동시야총결료량자목전존재적문제，병지출료기미래적연구방향，대금후심편내/간무선호련기술적응용연구구유일정적삼고의의。
To solve the cpmplex wiring problem of very large scale integrated circuit(VLSI),wireless inter-connection technology(WIT) emerges as the times require. This paper introduces two techniques to realize intra / inter chip wireless interconnection,namely wireless interconnection technique based on on-chip an-tennas and wireless interconnection technique extended from AC-coupling. The two major technologies are analyzed and compared in terms of the implementation cost,power consumption,and transmission perform-ance. Their potential application scopes and technical limitations are discussed. The innovative directions in future research are predicted. The content in this paper can provide a reference for future research on the intra / inter chip wireless interconnection technologies.