电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
6期
37-40
,共4页
低温共烧陶瓷%单膜层内置腔%制造%平整度
低溫共燒陶瓷%單膜層內置腔%製造%平整度
저온공소도자%단막층내치강%제조%평정도
low-temperature co-fired ceramic(LTCC)%embedded cavities with membrane%fabrication%flatness
LTCC单膜层内置腔在电容式传感器、微流系统等领域有重要应用,是3D-LTCC在微系统领域应用的典型结构类型。首先论述了目前实现内置腔制造的主流技术--牺牲层技术,并结合实验点明了该技术的关键难点。之后,提出了一种LTCC内置腔制造的新方法,并结合实验验证了该方法的可行性。新方法比牺牲层方法简便,更适合于高平整度腔膜层内置腔结构制造。
LTCC單膜層內置腔在電容式傳感器、微流繫統等領域有重要應用,是3D-LTCC在微繫統領域應用的典型結構類型。首先論述瞭目前實現內置腔製造的主流技術--犧牲層技術,併結閤實驗點明瞭該技術的關鍵難點。之後,提齣瞭一種LTCC內置腔製造的新方法,併結閤實驗驗證瞭該方法的可行性。新方法比犧牲層方法簡便,更適閤于高平整度腔膜層內置腔結構製造。
LTCC단막층내치강재전용식전감기、미류계통등영역유중요응용,시3D-LTCC재미계통영역응용적전형결구류형。수선논술료목전실현내치강제조적주류기술--희생층기술,병결합실험점명료해기술적관건난점。지후,제출료일충LTCC내치강제조적신방법,병결합실험험증료해방법적가행성。신방법비희생층방법간편,경괄합우고평정도강막층내치강결구제조。
Embedded cavities with membrane in Low-temperature Co-fired Ceramic(LTCC) substrate have important applications in capacitance sensors and micro-fluidic researches. And they are typical structure in microsystem applications with 3D-LTCC technology. Firstly, the current fabrication technology, which we called the sacrificial material technology, is illustrated. Moreover, the critical and difficult points of such method are denoted. Afterwards, a novel manner to manufacture the embedded cavities with membrane is presented. And its feasibility is verified experimentally. The results reveal that, the novel manner is more simple and convenient than the sacrificial material technology, which is appropriate for LTCC embedded cavities with high demands of the membrane.