电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
6期
4-6
,共3页
铜线键合%金属间化合物%高温存储%可靠性
銅線鍵閤%金屬間化閤物%高溫存儲%可靠性
동선건합%금속간화합물%고온존저%가고성
coupper wire%IMC%HTST%reliability
采用铜引线键合工艺生产的电子元器件在服役中会产生热，引起引线与金属化焊盘界面出现IMC（intermetallic compound，金属间化合物）。IMC的生长和分布将影响键合点的可靠性，严重时会出现“脱键”，导致元器件失效。研究了焊点在服役过程中的演化，选取铜线键合产品SOT-23为试验样品，分析了在高温存储试验环境下焊点键合界面IMC的生长及微观结构变化情况。
採用銅引線鍵閤工藝生產的電子元器件在服役中會產生熱，引起引線與金屬化銲盤界麵齣現IMC（intermetallic compound，金屬間化閤物）。IMC的生長和分佈將影響鍵閤點的可靠性，嚴重時會齣現“脫鍵”，導緻元器件失效。研究瞭銲點在服役過程中的縯化，選取銅線鍵閤產品SOT-23為試驗樣品，分析瞭在高溫存儲試驗環境下銲點鍵閤界麵IMC的生長及微觀結構變化情況。
채용동인선건합공예생산적전자원기건재복역중회산생열，인기인선여금속화한반계면출현IMC（intermetallic compound，금속간화합물）。IMC적생장화분포장영향건합점적가고성，엄중시회출현“탈건”，도치원기건실효。연구료한점재복역과정중적연화，선취동선건합산품SOT-23위시험양품，분석료재고온존저시험배경하한점건합계면IMC적생장급미관결구변화정황。
The electronic components of copper wire bonding process will generate heat in service, which cause the IMC(intermetallic compound)in the interface between the wire and the metallic bonding pad. The growth and distribution of IMC will affect the reliability of the bonding point, when seriously appears the break of solder ball from pad which lead to the device invalidation. Selected copper wire bonding product SOT-23 for the test samples in order to researching the solder joints evolution in service process, analysised the growth and microstructure changes of IMC in HTST.
