CAJ | 학술논문

针对手机后盖表面微结构的特点，采用微细电解和微细蚀刻的方法，对手机后盖压制模具的表面微结构加工进行工艺探索。设计了掩膜图形，研制了微细电解加工的纳秒脉冲电源。利用自行研制的多功能微细特种加工系统，采用阳极掩膜的方法进行微细电解加工，采用改进后的蚀刻机进行模具钢微细蚀刻加工。通过优化工艺，在模具钢材料上加工出尺寸为500μm的阵列微结构，并注塑出手机后盖，达到项目要求。
침대수궤후개표면미결구적특점，채용미세전해화미세식각적방법，대수궤후개압제모구적표면미결구가공진행공예탐색。설계료엄막도형，연제료미세전해가공적납초맥충전원。이용자행연제적다공능미세특충가공계통，채용양겁엄막적방법진행미세전해가공，채용개진후적식각궤진행모구강미세식각가공。통과우화공예，재모구강재료상가공출척촌위500μm적진렬미결구，병주소출수궤후개，체도항목요구。
In the light of the surface micro-structure characteristic of phone rear ,the process technology of surface micro-structure machining for phone rear mold in micro ECM and micro etching were studied. The mask was designed,the nanosecond pulse power of ECM is developed. The anode mask micro-ECM experiments was conducted in multi-functional micro non-traditional machining system,also micro etching experiments of die steel was conducted in etching machine. By optimizing the process,the array microstructure which size is 500 μm is machined in mold surface,and the phone rear was injected,and meted project requirements.