CAJ | 학술논문

通过定向凝固实验，研究 Cu-Ge 合金中的包晶反应过程。大的包晶反应三相区被用于研究包晶反应期间三相区界面的稳定性。在不同的生长条件和成分下，三相区呈现不同的生长形态。在 Cu-13.5%Ge亚包晶合金中，随着抽拉速率从2μm/s 提高到5μm/s，观察到了包晶相界面的失稳现象，而此时初生相的熔化界面相对稳定。但在 Cu-15.6%Ge 过包晶合金中，当抽拉速率达到5μm/s时，初生相重熔界面呈现非平面形态。基于成分过冷理论，分析初生相重熔界面和包晶相凝固界面的形态稳定性。
통과정향응고실험，연구 Cu-Ge 합금중적포정반응과정。대적포정반응삼상구피용우연구포정반응기간삼상구계면적은정성。재불동적생장조건화성분하，삼상구정현불동적생장형태。재 Cu-13.5%Ge아포정합금중，수착추랍속솔종2μm/s 제고도5μm/s，관찰도료포정상계면적실은현상，이차시초생상적용화계면상대은정。단재 Cu-15.6%Ge 과포정합금중，당추랍속솔체도5μm/s시，초생상중용계면정현비평면형태。기우성분과랭이론，분석초생상중용계면화포정상응고계면적형태은정성。
Peritectic reaction was studied by directional solidification of Cu-Ge alloys. A larger triple junction region of peritectic reaction was used to analyze the interface stability of the triple junction region during peritectic reaction. Under different growth conditions and compositions, different growth morphologies of triple junction region are presented. For the hypoperitectic Cu-13.5%Ge alloy, as the pulling velocity (v) increases from 2 to 5μm/s, the morphological instability of the peritectic phase occurs during the peritectic reaction and the remelting interface of the primary phase is relatively stable. However, for the hyperperitectic Cu-15.6%Ge alloy with v=5μm/s, the nonplanar remelting interface near the trijunction is presented. The morphological stabilities of the solidifying peritectic phase and the remelting primary phase are analyzed in terms of the constitutional undercooling criterion.