印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
7期
30-31,70
,共3页
层压对位精度%平整性%受力均匀
層壓對位精度%平整性%受力均勻
층압대위정도%평정성%수력균균
Laminated Alignment Accuracy%Flatness%Uniform Stress
随着电子元器件向着微型化的方向发展，线路板BGA（球栅阵列）区域间距大小也从0.80 mm发展到0.40 mm，这要求更高的层压对位精度，文章通过研究层压芯板叠层与其受力的规律，在现有设备工艺条件下，把层压对位精度大幅提升至0.038 mm。
隨著電子元器件嚮著微型化的方嚮髮展，線路闆BGA（毬柵陣列）區域間距大小也從0.80 mm髮展到0.40 mm，這要求更高的層壓對位精度，文章通過研究層壓芯闆疊層與其受力的規律，在現有設備工藝條件下，把層壓對位精度大幅提升至0.038 mm。
수착전자원기건향착미형화적방향발전，선로판BGA（구책진렬）구역간거대소야종0.80 mm발전도0.40 mm，저요구경고적층압대위정도，문장통과연구층압심판첩층여기수력적규률，재현유설비공예조건하，파층압대위정도대폭제승지0.038 mm。
Because of the electronic components becoming miniature, BGA pitch of the circuit boards changes from 0.80mm to 0.40mm, which requires better alignment accuracy in lamination. By researching the lamination of the core and its rules of the compressive stress, this paper improves lamination alignment accuracy to 1.5 mil without changing the equipments and process conditions presently existed.
