CAJ | 학술논문

目的：优化电感器线圈电镀工艺，研究电感线圈电镀过程中电流、电解质电势和镀层厚度分布规律。方法采用计算机仿真技术，基于电镀动力学、电化学理论、法拉第定理和移动网格理论，建立电感线圈匝数参数化的三维电感器线圈电镀模型。结果电感线圈外部的铜离子浓度较高，大约为309 mol/ m3。电感线圈最外圈的电镀厚度最厚，约7.3141μm。线圈外部较大的电流导致电镀线圈外侧出现较大的沉积速率。结论电解的铜离子的质量传递是影响电镀动力学的最主要因素，线圈电镀层厚度与电镀活性面上的电流分布相互作用。该电镀模型可用于分析线圈匝数对电镀工艺的影响，优化设计类似电镀工艺，研究电镀机理。
목적：우화전감기선권전도공예，연구전감선권전도과정중전류、전해질전세화도층후도분포규률。방법채용계산궤방진기술，기우전도동역학、전화학이론、법랍제정리화이동망격이론，건립전감선권잡수삼수화적삼유전감기선권전도모형。결과전감선권외부적동리자농도교고，대약위309 mol/ m3。전감선권최외권적전도후도최후，약7.3141μm。선권외부교대적전류도치전도선권외측출현교대적침적속솔。결론전해적동리자적질량전체시영향전도동역학적최주요인소，선권전도층후도여전도활성면상적전류분포상호작용。해전도모형가용우분석선권잡수대전도공예적영향，우화설계유사전도공예，연구전도궤리。
Objective To optimize the electroplating process of the inductor coil and study the current distribution, the electro-lyte potential and the coating thickness distribution during the electroplating process of the inductor coil. Methods The computer simulation technology was used to build a three-dimensional inductor coil plating model with regards to parameterized coil turns based on plating kinetics, electrochemistry theory, Faraday theorem, and moving mesh model. Results The external part of induc-tor had a high copper concentration of about 309 mol/ m3; the outermost plating inductor coil had the highest thickness of about 7. 3141 μm; the larger current in the external coil resulted in a larger plating deposition rate for the outer coil. Conclusion The mass transfer of electrolytic copper ion has the main effect on the plating kinetics. The plating thickness interacts with the current distribution on the active plating surface. The plating model can be used to analyze the impact of different plating turns on the plat-ing process, the optimization design of similar electroplating process and the study of electroplating mechanism.