机电工程技术
機電工程技術
궤전공정기술
MACHANICAL & ELECTRICAL ENGINEERING TECHNOLOGY
2014年
9期
77-80,137
,共5页
材料去除%光纤端面%研磨/抛光
材料去除%光纖耑麵%研磨/拋光
재료거제%광섬단면%연마/포광
material removal%optical fiber end-face%lapping/polishing
为了研究光纤端面的现行加工工艺,提出了一种光纤端面材料去除的分析方法。对被加工光纤端面和研抛工具先进行研磨压力的有限元分析,再模拟计算光纤研磨速度,最后分析去除率的材料。结果表明:光纤端面材料去除率的变化周期主要受研磨速度影响;成形初期的研磨去除率分布主要受研磨压力的影响;与平动式光纤研磨机相比,用行星回转式光纤研磨机加工一批单芯光纤和MPO多芯光纤插头时,由研磨速度的差异引起的各纤芯间材料去除率变化的最大值分别为3%和0.32%。本模拟分析方法建模简单,直观,模拟分析结果与生产现状相一致。
為瞭研究光纖耑麵的現行加工工藝,提齣瞭一種光纖耑麵材料去除的分析方法。對被加工光纖耑麵和研拋工具先進行研磨壓力的有限元分析,再模擬計算光纖研磨速度,最後分析去除率的材料。結果錶明:光纖耑麵材料去除率的變化週期主要受研磨速度影響;成形初期的研磨去除率分佈主要受研磨壓力的影響;與平動式光纖研磨機相比,用行星迴轉式光纖研磨機加工一批單芯光纖和MPO多芯光纖插頭時,由研磨速度的差異引起的各纖芯間材料去除率變化的最大值分彆為3%和0.32%。本模擬分析方法建模簡單,直觀,模擬分析結果與生產現狀相一緻。
위료연구광섬단면적현행가공공예,제출료일충광섬단면재료거제적분석방법。대피가공광섬단면화연포공구선진행연마압력적유한원분석,재모의계산광섬연마속도,최후분석거제솔적재료。결과표명:광섬단면재료거제솔적변화주기주요수연마속도영향;성형초기적연마거제솔분포주요수연마압력적영향;여평동식광섬연마궤상비,용행성회전식광섬연마궤가공일비단심광섬화MPO다심광섬삽두시,유연마속도적차이인기적각섬심간재료거제솔변화적최대치분별위3%화0.32%。본모의분석방법건모간단,직관,모의분석결과여생산현상상일치。
In order to investigate the existing process of optical fiber end-face, a simple material removal analysis on optical fiber end-face is established .Analyzing the fiber and lapping/polishing film posted on the rubber pad as follow,first the FEM static analysis of lapping pressure, secandly, simulating lapping/polishing velocity, at last analyze the material removal rate on basis of 1&2. Analysis results indicate that the material removal rate varied periodically with time, as like the lapping/polishing velocities, the distributions of material removal rate at beginning of the forming processing mainly affected by the lapping pressure;Using planetary rotary fiber lapper, not translational one,the Max. R/t among of single fiber end-faces is 3%,because of different lapping velocity and this value will up to 3%for the MPO end-face. This analysis is easy to model,and simulation results are corresponding to the processing.