CAJ | 학술논문

为了研究不同纳秒激光工艺参量（波长、能量密度、扫描速率）以及铜层厚度对激光刻蚀覆铜板质量（包括刻蚀深度及加工面粗糙度）的影响，采用50W的1064nm红外光纤激光器和10W的355nm紫外固体激光器对覆铜板进行了对比刻蚀实验。通过分析红外、紫外激光刻蚀覆铜板材料的作用机理并对比实验结果得知，采用1064nm红外光纤激光作为激光光源时，设置合适的刻蚀参量，能在完全去除铜箔层的条件下，最大限度地保证环氧树脂基底的完整性；而采用355nm的紫外激光作为激光光源时，因环氧树脂材料对紫外波段激光的高吸收率，以及紫外激光对有机材料的光化学作用，基底材料的损伤难以避免，此外，红外光纤激光具有较高的刻蚀效率。结果表明，综合光纤激光器高稳定性和高集成度的特点，若激光直接刻蚀技术被用于大规模覆铜板的工业加工中，红外光纤激光将更具优势性。
위료연구불동납초격광공예삼량（파장、능량밀도、소묘속솔）이급동층후도대격광각식복동판질량（포괄각식심도급가공면조조도）적영향，채용50W적1064nm홍외광섬격광기화10W적355nm자외고체격광기대복동판진행료대비각식실험。통과분석홍외、자외격광각식복동판재료적작용궤리병대비실험결과득지，채용1064nm홍외광섬격광작위격광광원시，설치합괄적각식삼량，능재완전거제동박층적조건하，최대한도지보증배양수지기저적완정성；이채용355nm적자외격광작위격광광원시，인배양수지재료대자외파단격광적고흡수솔，이급자외격광대유궤재료적광화학작용，기저재료적손상난이피면，차외，홍외광섬격광구유교고적각식효솔。결과표명，종합광섬격광기고은정성화고집성도적특점，약격광직접각식기술피용우대규모복동판적공업가공중，홍외광섬격광장경구우세성。
In order to study effect of nanosecond laser processing parameters ( such as wavelength , laser fluence , scanning speed ) and thickness of the copper layer on the processing quality of laser etching copper clad laminate ( including depth and roughness ), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate ( CCL ) in the comparative experiments .The action mechanisms of infrared laser and ultraviolet laser were analyzed .In the experiments , the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact .However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect .Besides, the infrared fiber laser had a higher processing efficiency .Therefore, with characteristics of high stability and stronger integration , 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL .