CAJ | 학술논문

随着武器系统高可靠性要求的不断加强和国产电子元器件基础水平的不断提高，越来越多的陶瓷封装军用SMD开始应用于型号产品。该类器件的引线多采用镀金工艺，焊接时必须进行除金处理。用四种焊接工艺方法对镀金引脚器件焊接，对比分析器件焊点的焊接质量，得出镀金引脚器件最佳焊接工艺方法。
수착무기계통고가고성요구적불단가강화국산전자원기건기출수평적불단제고，월래월다적도자봉장군용SMD개시응용우형호산품。해류기건적인선다채용도금공예，한접시필수진행제금처리。용사충한접공예방법대도금인각기건한접，대비분석기건한점적한접질량，득출도금인각기건최가한접공예방법。
With high reliability requirements of weapon system and improvement of the basis level of domestic electron components, more and more ceramic packaging of SMD apply to the military product. The component lead is mostly plated with gold, but the gold coating must be removed when the component is to be soldered. Compare and analyze the soldering quality of solder joints of golding-plated lead SMT components using four soldering methods, get the best soldering method for golding-plated lead components.