CAJ | 학술논문

借助ANSYS有限元分析软件，使用子模型分析技术对单晶结构和多晶结构两种不同晶体类型的无铅BGA焊点做了应力应变计算，并结合通过扫描电镜（SEM）获取的断裂焊点截面照片，对比分析了不同晶体类型对BGA焊点疲劳断裂失效的影响。得出结论：焊点晶体类型也是影响无铅BGA焊点疲劳断裂失效的重要因素。
차조ANSYS유한원분석연건，사용자모형분석기술대단정결구화다정결구량충불동정체류형적무연BGA한점주료응력응변계산，병결합통과소묘전경（SEM）획취적단렬한점절면조편，대비분석료불동정체류형대BGA한점피로단렬실효적영향。득출결론：한점정체류형야시영향무연BGA한점피로단렬실효적중요인소。
Submodeling is applied to calculate the stress and strain of both monocrystalline and polycrystallime of Pb-free BGA solder joint by ANSYS, which is a finite element analysis software, combined with pictures of the cross-section of solder joints obtained by scanning electronic microscope (SEM). The effect of different types of crystal on the fatigue fracture of BGA solder joint is investigated. And the type of crystal is one of key factors which make an effect on the fatigue fracture of Lead-free BGA solder joint.