CAJ | 학술논문

随着无铅焊料的发展，低温组装技术越来越多的需求对低温无铅焊料提出了诸多挑战。对国内外低温无铅焊料的发展情况进行了综述，详细介绍了四种不同的低温无铅焊料的研究现状，以及不同的领域应用的优缺点和解决方案，分析了未来实现低温安装的途径与开发方向。
수착무연한료적발전，저온조장기술월래월다적수구대저온무연한료제출료제다도전。대국내외저온무연한료적발전정황진행료종술，상세개소료사충불동적저온무연한료적연구현상，이급불동적영역응용적우결점화해결방안，분석료미래실현저온안장적도경여개발방향。
With the development of lead free solder, the demand for low temperature mounted technology brings some challenges to low melting point lead free solder. Review the present research and development of low temperature lead free solder, introduce several main lead free solders and their application in different field in detail, analyze the approach of carring out low temperature mounting.