CAJ | 학술논문

以MPEG400为溶剂，将定量锡块放入添加不同活性剂的溶液中加热保温，保温时间为1 h，考察锡块的质量变化，以研究不同温度下活性剂与焊锡材料的反应程度，进而用SEM进行反应形貌验证。实验结果表明，苹果酸在150℃以后与Sn0.3Ag0.7Cu焊锡材料反应强烈；丙二酸在100℃时与Sn0.3Ag0.7Cu焊锡材料的反应强于其他温度，125℃以后，随着温度的升高，反应反而减弱；三乙醇胺与Sn0.3Ag0.7Cu焊锡材料之间有微弱反应，随温度升高，反应强度增大。探讨温度对无铅焊锡膏用活性剂与Sn0.3Ag0.7Cu焊锡材料之间反应规律的影响，对助焊剂的研究具有重要指导意义。
이MPEG400위용제，장정량석괴방입첨가불동활성제적용액중가열보온，보온시간위1 h，고찰석괴적질량변화，이연구불동온도하활성제여한석재료적반응정도，진이용SEM진행반응형모험증。실험결과표명，평과산재150℃이후여Sn0.3Ag0.7Cu한석재료반응강렬；병이산재100℃시여Sn0.3Ag0.7Cu한석재료적반응강우기타온도，125℃이후，수착온도적승고，반응반이감약；삼을순알여Sn0.3Ag0.7Cu한석재료지간유미약반응，수온도승고，반응강도증대。탐토온도대무연한석고용활성제여Sn0.3Ag0.7Cu한석재료지간반응규률적영향，대조한제적연구구유중요지도의의。
Add a certain tin into the solvent which contained MPEG400 and a variety of active agent, and the time of heat preservation is one hour. Examine the quality change of tin, confirm the reaction degree of active agent and solder materials under different temperature, and then check the reaction profile by SEM. The experiment results show that: malic acid and solder material of Sn0.3Ag0.7Cu occur acute chemical reaction when the temperature is above 150℃; malonic acid and solder material of Sn0.3Ag0.7Cu have the maximum reaction activity at 100℃, and when the temperature is above 125℃, the activity decreased; triethanolamine solder material of Sn0.3Ag0.7Cu alleviate chemical reaction, and the reaction activity increases with rising temperature. Discusse the effect of temperature on reaction rules between active agent and solder material of Sn0.3Ag0.7Cu, has important guiding significance for research on soldering flux.