电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2014年
4期
187-189,233
,共4页
侯朝昭%邵远城%李茂源%胡雅婷%安兵%张云%WANG-Hui
侯朝昭%邵遠城%李茂源%鬍雅婷%安兵%張雲%WANG-Hui
후조소%소원성%리무원%호아정%안병%장운%WANG-Hui
无芯基板%IC封装基板%翘曲%半加成法%云纹干涉法
無芯基闆%IC封裝基闆%翹麯%半加成法%雲紋榦涉法
무심기판%IC봉장기판%교곡%반가성법%운문간섭법
Coreless substrate%IC package substrate%Warpage%Semi-additive method%Shadow Moiré method
手持电子产品的薄型化催生了IC封装无芯基板,它不仅比IC封装有芯基板更薄,而且电气性能更加优越。介绍了IC封装无芯基板的发展趋势和制造中面临的问题。IC封装无芯基板以半加成法制造,翘曲是目前制程中的首要问题。翘曲改善主要依靠改变绝缘层材料和积层结构,可用云纹干涉法进行量测,并以模拟为指导加快开发周期。
手持電子產品的薄型化催生瞭IC封裝無芯基闆,它不僅比IC封裝有芯基闆更薄,而且電氣性能更加優越。介紹瞭IC封裝無芯基闆的髮展趨勢和製造中麵臨的問題。IC封裝無芯基闆以半加成法製造,翹麯是目前製程中的首要問題。翹麯改善主要依靠改變絕緣層材料和積層結構,可用雲紋榦涉法進行量測,併以模擬為指導加快開髮週期。
수지전자산품적박형화최생료IC봉장무심기판,타불부비IC봉장유심기판경박,이차전기성능경가우월。개소료IC봉장무심기판적발전추세화제조중면림적문제。IC봉장무심기판이반가성법제조,교곡시목전제정중적수요문제。교곡개선주요의고개변절연층재료화적층결구,가용운문간섭법진행량측,병이모의위지도가쾌개발주기。
The thinning tendency of the handheld electronic products brought up the coreless substrate for IC Packages. Coreless substrate enables thinner thickness and superior electrical performance than core-contained substrate. Introduce the development trend and problems occurred during the manufacturing process of the coreless substrate. The coreless substrate is manufactured by the semi-additive method, and warpage is the primary problem during the process currently. The reduction of warpage mainly depends on the optimization of the insulated-layer materials and as well the construction of buildup layers. Warpage can be measured by Shadow Moiré method and simulated by FEA software, which can be used as the guidance to accelerate development cycle.