CAJ | 학술논문

现代电子封装迫切需要开发新型高导热陶瓷(玻璃)基复合材料.本文在对镀钛金刚石进行镀铜和控制氧化的基础上,利用放电等离子烧结方法制备了金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合情况,测定了复合材料的热导率和热膨胀系数.实验结果表明：复合材料微观组织均匀,Ti/金刚石界面是复合材料中结合最弱的界面,复合材料的热导率随着金刚石粒径和含量的增大而增加,而热膨胀系数随着金刚石含量的增加而降低.当金刚石粒径为100μm、体积分数为70%时,复合材料热导率最高达到了40.2W·m-1·K-1,热膨胀系数为3.3×10-6 K-1,满足电子封装材料的要求.
현대전자봉장박절수요개발신형고도열도자(파리)기복합재료.본문재대도태금강석진행도동화공제양화적기출상,이용방전등리자소결방법제비료금강석증강파리기복합재료,병관찰료기미관형모화계면결합정황,측정료복합재료적열도솔화열팽창계수.실험결과표명：복합재료미관조직균균,Ti/금강석계면시복합재료중결합최약적계면,복합재료적열도솔수착금강석립경화함량적증대이증가,이열팽창계수수착금강석함량적증가이강저.당금강석립경위100μm、체적분수위70%시,복합재료열도솔최고체도료40.2W·m-1·K-1,열팽창계수위3.3×10-6 K-1,만족전자봉장재료적요구.
It is emergent to develop new ceramic ( glass) matrix composites for modern electronic packaging. Based on copper plating and controlled oxidation of Ti-coated diamond particles, diamond-reinforced glass matrix composites were successfully synthe-sized by spark plasma sintering ( SPS) . Their micro-morphology, interface bonding condition, thermal conductivity, and coefficient of thermal expansion ( CTE) were investigated. The results show that the composites have uniform microstructure, and the Ti/diamond interface is the weakest in the composites. The thermal conductivity of the composites increases with increasing diamond particle size and content, but the CTE of the composites decreases with increasing diamond content. When the diamond particle size is 100μm and the diamond volume content is 70%, the composite has the highest thermal conductivity about 40. 2 W·m-1·K-1 and CTE about 3. 3 × 10 -6 K-1 ,which can meet the requirement of electronic packaging.