CAJ | 학술논문

在半导体材料中，金属薄膜尺寸缩小会使通电时的电流密度升高而导致材料焦耳热迅速增加，从而影响金属薄膜表面结构。针对纯铝薄膜进行了高温加热试验，模拟实际运行中的温度影响，并分析了影响机理。试验结果表明随着加热温度和加热时间的增加会使铝膜表面原子迁移能力增强，单位时间内原子积聚数量增加，从而导致小丘数量和体积增大。
재반도체재료중，금속박막척촌축소회사통전시적전류밀도승고이도치재료초이열신속증가，종이영향금속박막표면결구。침대순려박막진행료고온가열시험，모의실제운행중적온도영향，병분석료영향궤리。시험결과표명수착가열온도화가열시간적증가회사려막표면원자천이능력증강，단위시간내원자적취수량증가，종이도치소구수량화체적증대。
The structure and surface of the Al thin film was affected by Joule heating owing to high current density in the semiconductor materials. Heating treatments were used to investigate the effect of high temperature on the structure of the Al thin film, and the mechanism was derived. It was noted that Al atomic diffusion was enhanced with increasing heating temperature and time, leading to accumulating more atoms in unit time,and hence forming more hillocks with larger diameters.