CAJ | 학술논문

为改善高导热铝基覆铜板剥离强度、击穿电压稳定性和绝缘可靠性，通过二次涂覆法在铜箔表面涂覆不同导热填料含量的复合粘结剂，制得一种高导热铝基覆铜板，并与一次涂覆法制备的高导热铝基覆铜板进行性能对比分析。结果表明：两种涂覆方法制备的高导热铝基覆铜板的绝缘层中填料分散均匀，其导热系数和热阻差异较小，都能通过288℃极限(带铜)浸锡和PCT测试；采用二次涂覆法制备的高导热铝基覆铜板的剥离强度和耐电压值均比一次涂覆法的有较大的提高。
위개선고도열려기복동판박리강도、격천전압은정성화절연가고성，통과이차도복법재동박표면도복불동도열전료함량적복합점결제，제득일충고도열려기복동판，병여일차도복법제비적고도열려기복동판진행성능대비분석。결과표명：량충도복방법제비적고도열려기복동판적절연층중전료분산균균，기도열계수화열조차이교소，도능통과288℃겁한(대동)침석화PCT측시；채용이차도복법제비적고도열려기복동판적박리강도화내전압치균비일차도복법적유교대적제고。
To improve the peel strength, breakdown voltage, and insulating reliability of high thermal con-ductive aluminum based copper clad laminate(CCL), we prepared a high thermal conductive aluminum based CCL by coating the varnish with different content of thermal conductive filler on the copper foil surface twice, and its property was compared with the property of the aluminum based CCL prepared by once coating method. The results show that the filler can both well disperse in the insulation layer of the high thermal conductive aluminum based CCL prepared by the two methods, their thermal conductivi-ty and thermal resistance have little difference, and both of them can pass solderability test(with copper) and pressure cooker test(PCT). The high thermal conductivity aluminum base CCL prepared by twice coat-ing method has higher peel strength and breakdown voltage than that of the aluminum base CCL pre-pared by once coating method.