激光技术
激光技術
격광기술
LASER TECHNOLOGY
2014年
5期
632-637
,共6页
谢小柱%高勋银%陈蔚芳%魏昕%胡伟
謝小柱%高勛銀%陳蔚芳%魏昕%鬍偉
사소주%고훈은%진위방%위흔%호위
激光技术%激光划切%蓝宝石%532 nm激光%工艺参量研究
激光技術%激光劃切%藍寶石%532 nm激光%工藝參量研究
격광기술%격광화절%람보석%532 nm격광%공예삼량연구
laser technique%laser scribing%sapphire%532nm laser%process parameters study
为了提高划切蓝宝石的成品率和划切效率,研究了脉冲绿激光(波长532nm)的偏振性、脉冲激光能量、激光焦点位置、扫描速率、扫描次数等工艺参量对蓝宝石基片划切质量的影响。结果表明,脉冲绿激光划切蓝宝石基片时,扫描方向平行于入射面线偏振方向,焦点位置为负离焦50μm,可以获得良好的微划槽;脉冲激光能量增加,划槽深度和宽度增加;扫描速率增加,切槽深度减小,划槽宽度先增加后减小;扫描次数增加,划槽深度和宽度增加。这些结果对合理选择激光划切蓝宝石基片工艺参量以获得较好质量的刻槽有一定帮助。
為瞭提高劃切藍寶石的成品率和劃切效率,研究瞭脈遲綠激光(波長532nm)的偏振性、脈遲激光能量、激光焦點位置、掃描速率、掃描次數等工藝參量對藍寶石基片劃切質量的影響。結果錶明,脈遲綠激光劃切藍寶石基片時,掃描方嚮平行于入射麵線偏振方嚮,焦點位置為負離焦50μm,可以穫得良好的微劃槽;脈遲激光能量增加,劃槽深度和寬度增加;掃描速率增加,切槽深度減小,劃槽寬度先增加後減小;掃描次數增加,劃槽深度和寬度增加。這些結果對閤理選擇激光劃切藍寶石基片工藝參量以穫得較好質量的刻槽有一定幫助。
위료제고화절람보석적성품솔화화절효솔,연구료맥충록격광(파장532nm)적편진성、맥충격광능량、격광초점위치、소묘속솔、소묘차수등공예삼량대람보석기편화절질량적영향。결과표명,맥충록격광화절람보석기편시,소묘방향평행우입사면선편진방향,초점위치위부리초50μm,가이획득량호적미화조;맥충격광능량증가,화조심도화관도증가;소묘속솔증가,절조심도감소,화조관도선증가후감소;소묘차수증가,화조심도화관도증가。저사결과대합리선택격광화절람보석기편공예삼량이획득교호질량적각조유일정방조。
To improve the yield rate and scribing efficiency of sapphire substrate , the effect of polarization direction , laser power , focus position , cutting speed , scanning times on the scribing quality of sapphire substrate with pulse green laser (λ=532nm) was studied.The results show that narrow and deep grooves can be obtained when the polarization direction is parallel to the incidence plane and the laser focus position is negative defocus 50μm when scribing sapphire substrate with pulse green laser .The groove depth and width increase while the pulse laser power increases .The groove depth decreases and the groove width increases at first and then decreases with the increase of the scanning speed .The groove depth and width increase with the increase of the scanning times .The results are helpful for selection of reasonable laser scribing technical parameters to achieve optimal groove performance .