CAJ | 학술논문

光纤光栅的封装结构在应变测量中至关重要，表贴式结构简化了应变传递环节，能够提高应变传递效率和稳定性。光纤光栅应变传感的准确性取决于光纤-粘接层-基体之间的界面传递特性。本文以表贴式裸光纤光栅作为研究对象，建立传感器应变传递模型，并推导了基底实际应变与表贴的裸光纤光栅所测应变之间的关系，仿真分析了粘接层弹性模量、厚度、长度、宽度等粘接参数对平均应变传递率的影响，得到裸光纤光栅表贴结构粘接层的优化参数，为表贴式光纤光栅传感应用提供参考依据。选用高温固化环氧胶353 ND，将涂覆层为聚酰亚胺的裸光纤光栅粘贴于等强度梁上，进行应变传递效果评价实验，结果表明，表贴式裸光纤光栅随铝材基底的应变呈现良好的线性关系，应变灵敏度为1．13 pm/με，是基片式封装应变灵敏度的1．5倍，应变传递率达到94．2％，与理论分析结果较为接近，证明了表贴结构模型与粘接手段的正确性和可行性。
광섬광책적봉장결구재응변측량중지관중요，표첩식결구간화료응변전체배절，능구제고응변전체효솔화은정성。광섬광책응변전감적준학성취결우광섬-점접층-기체지간적계면전체특성。본문이표첩식라광섬광책작위연구대상，건립전감기응변전체모형，병추도료기저실제응변여표첩적라광섬광책소측응변지간적관계，방진분석료점접층탄성모량、후도、장도、관도등점접삼수대평균응변전체솔적영향，득도라광섬광책표첩결구점접층적우화삼수，위표첩식광섬광책전감응용제공삼고의거。선용고온고화배양효353 ND，장도복층위취선아알적라광섬광책점첩우등강도량상，진행응변전체효과평개실험，결과표명，표첩식라광섬광책수려재기저적응변정현량호적선성관계，응변령민도위1．13 pm/με，시기편식봉장응변령민도적1．5배，응변전체솔체도94．2％，여이론분석결과교위접근，증명료표첩결구모형여점접수단적정학성화가행성。
Fiber Bragg grating sensor packaging is very important in the strain measurement.Surface-bonded sensor can simplify strain transfer links and improve strain transfer efficiency and stability.The accuracy of fiber Bragg grating strain sensor depends on the transfer characteristics between fiber,adhesive layer and substrate.Taking surface-bonded bare fiber Bragg grating as exam-ples,the strain transfer model is built to study the strain transfer between the substrate and the bonded bare FBG,and derivation formula is adopted to represent the relationship between the actual strain of substrate and the measured strain by FBG.Based on the model,the influence of elasticity modulus,thickness,length,width of the adhesive on strain sensing performance is analyzed in simulation.The study has reference value on Surface-bonded FBG application.353ND was selected as the bonding materials.Bare FBG was bonged directly onto a beam of constant strength,which was recoated by polyimide.The experiment results show that, good linearity between FBG central wavelength and the strain,and the strain sensitivity is 1 .1 3 pm/με,which is 1 .5 times of sub-strate packaging FBG.The strain transform coefficient reaches 94.2%.It is in good accordance with the theoretical analysis, which proves the correctness and feasibility of the model and bonding technical approach.