CAJ | 학술논문

三维集成电路（3D IC）带来了诸多的益处，譬如高带宽，低功耗，外形尺寸小。基于硅通孔的三维集成得到了行业的广泛采用。然而，硅通孔的制造过程引入了新的缺陷机制。一个失效的硅通孔会使整个芯片失效，会极大地增加成本。增加冗余硅通孔修复失效硅通孔可能是最有效的提高良率的方法，但是却带来了面积成本。提出了一种基于链式的信号转移冗余方案，输入端从下一分组选择信号硅通孔传输信号。在基于概率模型下，提出的冗余结构良率可以达到99%，同时可以减少冗余TSV的数目。
삼유집성전로（3D IC）대래료제다적익처，비여고대관，저공모，외형척촌소。기우규통공적삼유집성득도료행업적엄범채용。연이，규통공적제조과정인입료신적결함궤제。일개실효적규통공회사정개심편실효，회겁대지증가성본。증가용여규통공수복실효규통공가능시최유효적제고량솔적방법，단시각대래료면적성본。제출료일충기우련식적신호전이용여방안，수입단종하일분조선택신호규통공전수신호。재기우개솔모형하，제출적용여결구량솔가이체도99%，동시가이감소용여TSV적수목。
Three-Dimensional Integrated Circuits(3D IC)have brought many benefits, such as high-bandwidth, low-power, and small form-factor. Three-Dimensional(3D)integration based on Through-Silicon-Via(TSV)is rapidly adopted in industry. However, manufacturing processes for TSVs introduce new failure mechanisms. A defective TSV can fail the entire chip, this can severely increase the cost. Adding redundant TSVs to repair faulty ones is probably the most effective method to enhance yield, but it increases the cost of area. This paper presents a signal shift redundant TSVs scheme based on chain design, the input transfers signal by selecting signal TSVs from the next group. Based on probabilistic model, the proposed structure can achieve 99%yield, at the same time, it can reduce the number of redundant TSVs.