电子科技大学学报
電子科技大學學報
전자과기대학학보
JOURNAL OF UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
2014年
4期
547-551
,共5页
陈淑仙%田鹤%秦文峰%李梦%杨文锋%唐庆如
陳淑仙%田鶴%秦文峰%李夢%楊文鋒%唐慶如
진숙선%전학%진문봉%리몽%양문봉%당경여
固化%有限元方法%树脂基复合材料%温度分布%热应力
固化%有限元方法%樹脂基複閤材料%溫度分佈%熱應力
고화%유한원방법%수지기복합재료%온도분포%열응력
curing%finite element method%resin matrix composite%temperature distribution%thermal stress
建立了热固性树脂基复合材料固化过程温度和热应力场分析的数学模型,采用有限元方法,进行了三维非稳态数值求解。通过与已有实验结果的比较,验证了数学模型和计算方法的正确性。获得了3234/T300层合板固化过程中内部温度及热应力分布,分析了保温时间、升温速率、铺层设计等对温度、内部热应力的影响。数值计算结果表明:预固化时间越长,层合板内温度梯度越小,热应力峰值越低;升温速率越大,层合板内温度梯度越大,热应力峰值越大;采用对称铺层可降低层合板内部温度梯度和热应力。
建立瞭熱固性樹脂基複閤材料固化過程溫度和熱應力場分析的數學模型,採用有限元方法,進行瞭三維非穩態數值求解。通過與已有實驗結果的比較,驗證瞭數學模型和計算方法的正確性。穫得瞭3234/T300層閤闆固化過程中內部溫度及熱應力分佈,分析瞭保溫時間、升溫速率、鋪層設計等對溫度、內部熱應力的影響。數值計算結果錶明:預固化時間越長,層閤闆內溫度梯度越小,熱應力峰值越低;升溫速率越大,層閤闆內溫度梯度越大,熱應力峰值越大;採用對稱鋪層可降低層閤闆內部溫度梯度和熱應力。
건립료열고성수지기복합재료고화과정온도화열응력장분석적수학모형,채용유한원방법,진행료삼유비은태수치구해。통과여이유실험결과적비교,험증료수학모형화계산방법적정학성。획득료3234/T300층합판고화과정중내부온도급열응력분포,분석료보온시간、승온속솔、포층설계등대온도、내부열응력적영향。수치계산결과표명:예고화시간월장,층합판내온도제도월소,열응력봉치월저;승온속솔월대,층합판내온도제도월대,열응력봉치월대;채용대칭포층가강저층합판내부온도제도화열응력。
A three-dimensional unsteady finite element analysis model is developed for the simulation of the temperature and thermal stress fields of the thermosetting resin matrix composite laminate during the curing process. The correctness of the numerical model and methodology is verified by comparing with the available experimental results. The distributions of temperature and thermal stress in 3234/T300 composite laminates during curing process are numerically predicted. The effects of the pre-curing time, heating rate and the stacking sequence on the temperature and thermal stress fields during curing process are analyzed. The numerical computation. results indicate that the temperature gradient and thermal stress in the laminates decrease with the increasing pre-curing time and decreasing heating rate. Using symmetrical stacking sequence can also decrease the temperature gradient and thermal stress in composite laminates.