CAJ | 학술논문

为了判断 TDICCD 相机成像系统在温度循环试验中出现的故障原因,通过故障模式影响及危害性分析,建立了故障树.经排查分析和测试,判断故障部位是地址线表面贴装片式电阻.元器件可靠性中心通过电测和 DPA,对该片式电阻进行了失效分析.检查结果表明,该片式电阻是由使用过程中的异常外力造成片式电阻器端电极局部脱落,并排除了该器件存在批次性缺陷的可能.异常外力的来源是电装操作人员在返修过程中焊接时间过长,热应力导致片式电阻器端电极局部脱落.改进措施为严格控制片式电阻焊接时间小于2 s.该故障定位准确,机理清楚,经试验验证,措施有效.
위료판단 TDICCD 상궤성상계통재온도순배시험중출현적고장원인,통과고장모식영향급위해성분석,건립료고장수.경배사분석화측시,판단고장부위시지지선표면첩장편식전조.원기건가고성중심통과전측화 DPA,대해편식전조진행료실효분석.검사결과표명,해편식전조시유사용과정중적이상외력조성편식전조기단전겁국부탈락,병배제료해기건존재비차성결함적가능.이상외력적래원시전장조작인원재반수과정중한접시간과장,열응력도치편식전조기단전겁국부탈락.개진조시위엄격공제편식전조한접시간소우2 s.해고장정위준학,궤리청초,경시험험증,조시유효.
In order to determine the fault reason of TDI CCD camera imaging system during tempera-ture cycle experimentation,the failure tree is established through fault mode effect and harm analysis. Through detail checking and testing,the fault is located in the region where the surface mount resistor is mounted for address.The failure analysis of this chip resistor is done in the components reliability center through electric test and DPA.Checking results show that exceptional stress causes terminal break off of the resistor during operation.The lot default probability is also precluded.The excep-tional stress is derived from long time soldering during the repair by the soldering people.This ther-mal stress causes the terminal break off of the resistor.The fault is located correctly.The improved measure is limiting the soldering time of chip resistors strictly no more than 2 s.The principle is also clear.The solution is effective after experimental validation.