CAJ | 학술논문

镀金板的可焊性问题，也是业界经常面临的难题。业内普遍认为是镍层有机污染严重、阻焊残留导致，而系统深入地研究很少。本文由生产实际出发并结合相关试验测试，从镍氧化的角度，对镀金板可焊性不良的机理进行了深入分析，找到关键影响因素，为改善提供切实有效的理论依据。
도금판적가한성문제，야시업계경상면림적난제。업내보편인위시얼층유궤오염엄중、조한잔류도치，이계통심입지연구흔소。본문유생산실제출발병결합상관시험측시，종얼양화적각도，대도금판가한성불량적궤리진행료심입분석，조도관건영향인소，위개선제공절실유효적이론의거。
The solderability problems of the plating gold plate were in existence at all times. Now the theory that the serious organic pollution of nickel and the remnant solder mask resulted in the poor solderability had been accepted universally in PCB industry, but in-depth analysis and research about the theory was less. The factor of effect and the mechanism on solderability problems was discussed in this paper by means of some experiments connected to manufacture from the angle of nickel oxidation, and it hoped to be the technology support to improve the discoloration problem.