CAJ | 학술논문

结合电路板阻焊塞孔工艺技术产品批产化，根据生产线现有设备的实际情况，解决阻焊塞孔印制板加工过程所遇到由于过孔阻焊塞孔不良（空洞及露铜等）而导致锡珠入孔，造成的短路异常风险隐患等各种工艺难题。采用此种工艺制作技术方法均可实现阻焊塞孔印制板产品的批量在线的加工。
결합전로판조한새공공예기술산품비산화，근거생산선현유설비적실제정황，해결조한새공인제판가공과정소우도유우과공조한새공불량（공동급로동등）이도치석주입공，조성적단로이상풍험은환등각충공예난제。채용차충공예제작기술방법균가실현조한새공인제판산품적비량재선적가공。
The work of the paper is based on the project of “the batch production of the circuit board with the resistance welding and hole clogging technology”. The existing equipment is faced the short circuit or other fault because the solder ball has been easily fiown into the connection holes for the resistance welding and hole clogging. And the study concluded that this new technological processes has no damage effect on the batch production of PCB.