印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
8期
32-38
,共7页
刘厚文%付学明%马忠义%尚建蓉
劉厚文%付學明%馬忠義%尚建蓉
류후문%부학명%마충의%상건용
镀铜溶液%高厚径比微小孔%贯孔率%均匀性%设备改造
鍍銅溶液%高厚徑比微小孔%貫孔率%均勻性%設備改造
도동용액%고후경비미소공%관공솔%균균성%설비개조
Copper Plating Solution%High Thickness to Diameter Rratio of Micro Holes%The Penetration Rate of Hole%Uniformity%Equipment Modification
文章针对我公司垂直电镀线电镀高厚径比微小孔产品镀层均匀性不佳的状况，通过一系列实验分析，增加电镀前的处理方式提高了高厚径比微小孔产品的贯孔率，在阳极增加挡板，以及在浮架侧面进行开孔等改造措施，改善了电镀均匀性，使其均匀程度得到了提高。这有着较大的现实意义。
文章針對我公司垂直電鍍線電鍍高厚徑比微小孔產品鍍層均勻性不佳的狀況，通過一繫列實驗分析，增加電鍍前的處理方式提高瞭高厚徑比微小孔產品的貫孔率，在暘極增加擋闆，以及在浮架側麵進行開孔等改造措施，改善瞭電鍍均勻性，使其均勻程度得到瞭提高。這有著較大的現實意義。
문장침대아공사수직전도선전도고후경비미소공산품도층균균성불가적상황，통과일계렬실험분석，증가전도전적처리방식제고료고후경비미소공산품적관공솔，재양겁증가당판，이급재부가측면진행개공등개조조시，개선료전도균균성，사기균균정도득도료제고。저유착교대적현실의의。
Based on our company vertical plating line high plating thickness to diameter ratio of micro hole product coating uniformity of poor condition, through a series of experimental analysis, by increasing the treatment before plating, we can improve the high thickness to diameter ratio of micro hole penetration hole rate of products. By finished at the anode added baffie, and take the measure of fioat bridge on opening, we improved the uniformity of the plating, and uniformity. It is of great significance in practice.
