电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
8期
42-44
,共3页
光刻%涂胶%均匀性%RRC
光刻%塗膠%均勻性%RRC
광각%도효%균균성%RRC
photolithography%coat%uniformity%reduced resist consumption
为降低涂胶工序的生产成本，减少光刻胶的用量，需要在涂胶工艺上不断改进和提高。从原来传统的涂胶工艺到RRC（Reduced Resist Consumption）工艺，能够使光刻胶的用量减少，而随着光刻胶用量的减少，圆片上胶厚的均匀性也在发生剧烈的变化。同时光刻涂胶工序最重要的工艺要求就是胶厚和均匀性，它直接影响着后续曝光工艺的稳定性。在RRC工艺下，通过对喷胶转速、排风、喷胶速率等涂胶参数进行多次试验，最终找出影响胶厚均匀性的参数及其调整方法，来达到工艺要求的胶厚及均匀性，保障工艺生产的稳定性。
為降低塗膠工序的生產成本，減少光刻膠的用量，需要在塗膠工藝上不斷改進和提高。從原來傳統的塗膠工藝到RRC（Reduced Resist Consumption）工藝，能夠使光刻膠的用量減少，而隨著光刻膠用量的減少，圓片上膠厚的均勻性也在髮生劇烈的變化。同時光刻塗膠工序最重要的工藝要求就是膠厚和均勻性，它直接影響著後續曝光工藝的穩定性。在RRC工藝下，通過對噴膠轉速、排風、噴膠速率等塗膠參數進行多次試驗，最終找齣影響膠厚均勻性的參數及其調整方法，來達到工藝要求的膠厚及均勻性，保障工藝生產的穩定性。
위강저도효공서적생산성본，감소광각효적용량，수요재도효공예상불단개진화제고。종원래전통적도효공예도RRC（Reduced Resist Consumption）공예，능구사광각효적용량감소，이수착광각효용량적감소，원편상효후적균균성야재발생극렬적변화。동시광각도효공서최중요적공예요구취시효후화균균성，타직접영향착후속폭광공예적은정성。재RRC공예하，통과대분효전속、배풍、분효속솔등도효삼수진행다차시험，최종조출영향효후균균성적삼수급기조정방법，래체도공예요구적효후급균균성，보장공예생산적은정성。
Some method had been used to reduce the semiconductor manufacture cost, such as reducing photo resist consumption, which result in the uniformity of photo resist becoming more lager. Photo resist uniformity and thickness are the important process parameter which could influence the quality of exposal process. By changing chuck rotation speed, pump velocity, exhaust, the best process condition for RRC process has been accomplished, the relationship between photo resist uniformity and other process condition has been developed;The photo resist uniformity and thickness can be controlled steadily and make sure the steady of the fab process.
