电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
8期
1-7,48
,共8页
丁荣峥%马国荣%李杰%陈桂芳%史丽英
丁榮崢%馬國榮%李傑%陳桂芳%史麗英
정영쟁%마국영%리걸%진계방%사려영
陶瓷外壳%Ni-Co+Au镀层%键合强度%键合可靠性
陶瓷外殼%Ni-Co+Au鍍層%鍵閤彊度%鍵閤可靠性
도자외각%Ni-Co+Au도층%건합강도%건합가고성
ceramic package%Ni-Co+Au plating%bond strength%bonding reliability
为了提高陶瓷外壳镀层耐高温变色、耐腐蚀以及长期贮存的能力,带金属零件的陶瓷外壳需采用Co含量在20%~40%的Ni-Co+Au镀覆结构,镀层经退火处理。研究分析了Ni+Au镀覆和Ni-Co+Au镀覆结构对铝丝楔焊和金丝球焊可靠性的影响,通过常温、300℃高温贮存1 h、300℃高温贮存24 h后引线键合强度变化、键合面的元素面分布进行量化比较。试验表明Ni+Au和Ni-Co+Au镀覆结构对引线键合强度和可靠性无明显影响;两种镀覆结构的外壳在键合时,键合工艺参数也不需要进行较大的调整;铝丝在Ni-Co+Au镀覆结构与Ni+Au镀覆结构上键合,在键合界面均会生成金铝金属间化合物,但只要金层厚度受控,均不会产生“Kirkendall”失效,相对来讲Ni-Co+Au镀覆结构的缺陷密度较低,生成金铝金属间化合物进程会慢些。
為瞭提高陶瓷外殼鍍層耐高溫變色、耐腐蝕以及長期貯存的能力,帶金屬零件的陶瓷外殼需採用Co含量在20%~40%的Ni-Co+Au鍍覆結構,鍍層經退火處理。研究分析瞭Ni+Au鍍覆和Ni-Co+Au鍍覆結構對鋁絲楔銲和金絲毬銲可靠性的影響,通過常溫、300℃高溫貯存1 h、300℃高溫貯存24 h後引線鍵閤彊度變化、鍵閤麵的元素麵分佈進行量化比較。試驗錶明Ni+Au和Ni-Co+Au鍍覆結構對引線鍵閤彊度和可靠性無明顯影響;兩種鍍覆結構的外殼在鍵閤時,鍵閤工藝參數也不需要進行較大的調整;鋁絲在Ni-Co+Au鍍覆結構與Ni+Au鍍覆結構上鍵閤,在鍵閤界麵均會生成金鋁金屬間化閤物,但隻要金層厚度受控,均不會產生“Kirkendall”失效,相對來講Ni-Co+Au鍍覆結構的缺陷密度較低,生成金鋁金屬間化閤物進程會慢些。
위료제고도자외각도층내고온변색、내부식이급장기저존적능력,대금속령건적도자외각수채용Co함량재20%~40%적Ni-Co+Au도복결구,도층경퇴화처리。연구분석료Ni+Au도복화Ni-Co+Au도복결구대려사설한화금사구한가고성적영향,통과상온、300℃고온저존1 h、300℃고온저존24 h후인선건합강도변화、건합면적원소면분포진행양화비교。시험표명Ni+Au화Ni-Co+Au도복결구대인선건합강도화가고성무명현영향;량충도복결구적외각재건합시,건합공예삼수야불수요진행교대적조정;려사재Ni-Co+Au도복결구여Ni+Au도복결구상건합,재건합계면균회생성금려금속간화합물,단지요금층후도수공,균불회산생“Kirkendall”실효,상대래강Ni-Co+Au도복결구적결함밀도교저,생성금려금속간화합물진정회만사。
In order to improve the anti-tarnish plating ceramic package ability, corrosion resistance and long-term storage capability, ceramic package with metal parts requires Ni-Co plating layer containing Co with in 40%mass of the layer and then can be used by the consumers after electroplating Au layer. The paper compareswire bonding intensity and element distribution under the temperature:room temperature, 300℃in one hour and 300℃in 24 hours. It analyzes the reliability influence of aluminum wire wedge bonds and the gold ball bonds processunder the condition:Ni+Au plating layer and Ni-Co+Au plating layer. The experiments indicate that Ni-Co and Ni-Au plating layer do no obvious effect on the reliance and the bond strength.Existing bonding process also does not need to make adjustments to meet the bond strength and bond interconnect reliability. Aluminum wire bonding in the Ni-Co+Au plating layer or the Ni+Au plating layer were generated between Au-Al intermetallic compounds in the bonding interface, but as long as the thickness of the gold layer is controlled, it will not produce"Kirkendall"failure, relatively speaking, a Ni-Co+Au plating layer is relatively low defect density, aluminum intermetallic compounds generated process will be slower.