CAJ | 학술논문

溅射靶材的微观组织均匀性、晶粒尺寸大小及晶粒取向分布对溅射性能有着直接的影响。采用电子背散射衍射(EBSD)技术对制备的高纯Au溅射靶材不同区域的微观组织、织构组分和晶界取向差进行了研究。结果表明，高纯金靶材整体晶粒尺寸分布均匀，平均尺寸192.5 nm，边沿及中心晶界取向差分布比较相似，组织均匀性良好，对溅射高质量薄膜十分有利。
천사파재적미관조직균균성、정립척촌대소급정립취향분포대천사성능유착직접적영향。채용전자배산사연사(EBSD)기술대제비적고순Au천사파재불동구역적미관조직、직구조분화정계취향차진행료연구。결과표명，고순금파재정체정립척촌분포균균，평균척촌192.5 nm，변연급중심정계취향차분포비교상사，조직균균성량호，대천사고질량박막십분유리。
The function of sputtering targets is directly affected by the homogeneity of microstructure, grain size and orientation distribution. The microstructure and texture in the different regions of high pure gold sputtering targets is analyzed by EBSD. According to studying result, the grain size and microstructure of the prepared target is uniform, average grain size is 192.5 nm. The misorientation distribution of edge and center in gold target is quite similar. All of these are beneficial for high quality sputtered film.