贵金属键合丝材料的研究进展
귀금속건합사재료적연구진전
Research Progress on thePrecious Metal Bonding Wire Materials
  • 万方数据
    贵金属 귀금속
    PRECIOUS METALS
    2014年 3期 66-70 ,共5页

    陈永泰%谢明%王松%张吉明%杨有才%栄满门%王塞北%胡洁琼%李爱坤%魏宽

    진영태%사명%왕송%장길명%양유재%영만문%왕새북%호길경%리애곤%위관

    金属材柞%贵金属键合丝%合金成分%制备工艺%发展现状 金屬材柞%貴金屬鍵閤絲%閤金成分%製備工藝%髮展現狀
    금속재작%귀금속건합사%합금성분%제비공예%발전현상
    metal materials%precious metal bonding wire%alloy composition%preparation technology%research state
    贵金属键合丝是半导体封装的关键材柞之一，详细综述柚键合金丝、键合金银丝、键合银丝和镀钯键合铜丝的合金成分设计，制备工艺和发展现状，并展望柚其未来发展前景。
    귀금속건합사시반도체봉장적관건재작지일，상세종술유건합금사、건합금은사、건합은사화도파건합동사적합금성분설계，제비공예화발전현상，병전망유기미래발전전경。
    Precious metal bonding wire are one of key materials in semiconductor packaging. The alloy composition, preparation technology and research situation of Au bonding wire, Au-Ag bonding wire, Ag bonding wire and Pd-plated bonding Cu wire were summarized. In the meantime, the research prospect of precious metal bonding wire was also forecasted.
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