CAJ | 학술논문

在金刚石粉体表面通过化学沉积得到铜金属镀层,通过 X 射线衍射(XRD)、扫描电镜(SEM)等测试手段研究了镀液温度对镀速、镀层组织及形貌的影响。结果表明：当镀液温度低于30℃时,镀速为零,反应不能发生；温度在30~45℃时,随着温度的升高,铜的衍射峰逐渐增强；45℃时,基体完全被覆盖,镀层致密均匀；温度在45~50℃时,衍射峰进一步增强,镀层晶粒明显变大,致密度降低,表层有脱落现象；随着温度进一步增大,铜的衍射峰强度开始降低,60℃时,镀层有明显的脱落,翻边起皮现象。
재금강석분체표면통과화학침적득도동금속도층,통과 X 사선연사(XRD)、소묘전경(SEM)등측시수단연구료도액온도대도속、도층조직급형모적영향。결과표명：당도액온도저우30℃시,도속위령,반응불능발생；온도재30~45℃시,수착온도적승고,동적연사봉축점증강；45℃시,기체완전피복개,도층치밀균균；온도재45~50℃시,연사봉진일보증강,도층정립명현변대,치밀도강저,표층유탈락현상；수착온도진일보증대,동적연사봉강도개시강저,60℃시,도층유명현적탈락,번변기피현상。
The copper coating were deposited on the surface of diamond powder using chemical deposition.The plating rate,organization and surface morphology were changed by the temperature of plating bath, which was investigated through X-ray diffraction technique and scanning electron microscope analysis.The results showed that the plating rate was zero and no reaction could occur when the temperature was lower than 30 ℃.The intensity of copper peak strengthened with the increase of the temperature when the temperature was in the range of 30 - 45 ℃.The substrate was coating of copper completely,and the coating was uniform and dense when the temperature was 45 ℃.The copper peak intensity was further enhanced, the grain size was significantly larger, the coating density decreased and had a exfoliation phenomenon when the temperature was at 45 -50 ℃.The copper peak intensity weakened with the increasing of the temperature when the temperature was above 50 ℃.The plating had an obvious exfoliation and edge curl phenomenon when the temperature was at 60 ℃.