印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
11期
50-54
,共5页
葛春%罗龙%樊后星%任军成
葛春%囉龍%樊後星%任軍成
갈춘%라룡%번후성%임군성
盲埋孔板%树脂塞孔%孔口凹陷
盲埋孔闆%樹脂塞孔%孔口凹陷
맹매공판%수지새공%공구요함
PCB with Blind/Buried Holes%Resin Filling%Filled Via Depression/Dimple
文章针对盲埋孔板的次外层压板树脂塞孔之孔口凹陷问题，通过对不同板厚、树脂、固化条件的试验，分析得出适合不同条件下的选择方案，预防今后问题的再次发生。
文章針對盲埋孔闆的次外層壓闆樹脂塞孔之孔口凹陷問題，通過對不同闆厚、樹脂、固化條件的試驗，分析得齣適閤不同條件下的選擇方案，預防今後問題的再次髮生。
문장침대맹매공판적차외층압판수지새공지공구요함문제，통과대불동판후、수지、고화조건적시험，분석득출괄합불동조건하적선택방안，예방금후문제적재차발생。
For the case on dimple of resinfilling of PCB with blind/buried holes during sub-board pressing, the article focuses on the trial run and rebuilding with different board thickness, resin type and cure condition. We will draw the conclusion and method whichfit for different condition, and can avoid the case happed in future.
