CAJ | 학술논문

PCB过孔与连接器的连接品质极大的影响阻抗一致性及信号完整性，因此压接孔孔径公差要求非常高。文章即是在此背景下，针对性实验测试各工序对孔径的影响规律，然后再结合统计理论和误差分析，界定了成品孔径公差能力并给出工艺控制方法。这对于实现高频高速PCB产品高过孔性能要求提供了技术支持
PCB과공여련접기적련접품질겁대적영향조항일치성급신호완정성，인차압접공공경공차요구비상고。문장즉시재차배경하，침대성실험측시각공서대공경적영향규률，연후재결합통계이론화오차분석，계정료성품공경공차능력병급출공예공제방법。저대우실현고빈고속PCB산품고과공성능요구제공료기술지지
The connection quality between connector and via-hole has a great impact on impedance of via and signal integrity. Therefore it should be assured that high requirement for aperture tolerance of crimping hole. Based on above background, this paper focus on study how each process infiuences the aperture tolerance through experimental tests, and then combined with statistical theory analysis, to define the capability offinished aperture tolerance and put forward process control method. The results of this study will provide technical support for manufacturing of high frequency and high-speed PCB product with high performance requirements of via-holes.