CAJ | 학술논문

背面减薄技术对于提高量子阱红外焦平面探测器的性能有着重要的意义，通过衬底减薄能够缓解探测器芯片与读出电路的热膨胀失配，提高互连混成芯片可靠性，同时能够有效降低串扰。本文结合机械研磨、化学机械抛光和选择性湿法腐蚀技术，实现了量子阱探测器互连混成芯片的衬底完全去除。
배면감박기술대우제고양자정홍외초평면탐측기적성능유착중요적의의，통과츤저감박능구완해탐측기심편여독출전로적열팽창실배，제고호련혼성심편가고성，동시능구유효강저천우。본문결합궤계연마、화학궤계포광화선택성습법부식기술，실현료양자정탐측기호련혼성심편적츤저완전거제。
Substrate thinning technology has a great significance for raising performance of quantum well infrared de-tector (QWIP). Through substrate thinning,thermal expansion mismatch between detector chip and ROIC is de-creased,which improves the reliability of chip and reduces the crosstalk. Combined with mechanical polishing,chemi-cal mechanical polishing and selective wet etching,complete elimination of QWIP substrate is accomplished.