CAJ | 학술논문

由于具备较高的热导率，铜/金刚石复合材料已成为应用于电子封装领域的新一代热管理材料。采用放电等离子烧结工艺(SPS)成功制备含不同金刚石体积分数的Cu/金刚石复合材料，研究复合材料的相对密度、微观结构均匀性和热导率(TC)随金刚石体积分数(50%、60%和70%)和烧结温度的变化规律。结果表明：随着金刚石体积分数的降低，复合材料的相对密度、微观结构均匀性和热导率均升高；随着烧结温度的提高，复合材料的相对密度和热导率不断提高。复合材料的热导率受到金刚石体积分数、微观结构均匀性和复合材料相对密度的综合影响。
유우구비교고적열도솔，동/금강석복합재료이성위응용우전자봉장영역적신일대열관리재료。채용방전등리자소결공예(SPS)성공제비함불동금강석체적분수적Cu/금강석복합재료，연구복합재료적상대밀도、미관결구균균성화열도솔(TC)수금강석체적분수(50%、60%화70%)화소결온도적변화규률。결과표명：수착금강석체적분수적강저，복합재료적상대밀도、미관결구균균성화열도솔균승고；수착소결온도적제고，복합재료적상대밀도화열도솔불단제고。복합재료적열도솔수도금강석체적분수、미관결구균균성화복합재료상대밀도적종합영향。
Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering (SPS) method. The sintering temperatures and volume fractions (50%, 60% and 70%) of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.