CAJ | 학술논문

提出了一种新的LED灯具封装方式，使用高导热玻璃壳和惰性气体替代传统的环氧树脂进行封装，使用塑料散热器代替传统铝基板，以达到双通道散热的效果。采用ANSYS有限元热分析软件，优化惰性气体层厚度，并通过改变LED个数和单灯功率与传统的陶瓷基板COB封装方式进行热仿真对比分析。研究表明，惰性气体层厚度为1.5 mm时散热效果较好，双通道散热灯具的热阻远小于单通道散热灯具热阻。由于玻璃与传统的环氧树脂相比，透光性高、不易老化、抗紫外线效果好，在大功率、密集型封装和紫外LED灯具大发展的市场环境下，这种新的封装方式应用前景广阔。
제출료일충신적LED등구봉장방식，사용고도열파리각화타성기체체대전통적배양수지진행봉장，사용소료산열기대체전통려기판，이체도쌍통도산열적효과。채용ANSYS유한원열분석연건，우화타성기체층후도，병통과개변LED개수화단등공솔여전통적도자기판COB봉장방식진행열방진대비분석。연구표명，타성기체층후도위1.5 mm시산열효과교호，쌍통도산열등구적열조원소우단통도산열등구열조。유우파리여전통적배양수지상비，투광성고、불역노화、항자외선효과호，재대공솔、밀집형봉장화자외LED등구대발전적시장배경하，저충신적봉장방식응용전경엄활。
A new encapsulating mode for LED luminaire is introduced. Dual channel heat-dissipation effect is obtained by using high thermal conductive glass shell and inert gas to encapsulate instead of traditional epoxy resin and using plastic heating-radiator instead of traditional aluminum substrate. The thickness of inert gas layer is opti-mized with ANSYS finite element thermal analysis software. Thermal simulation results are compared and analyzed through changing the number of LED, the power of a single LED and traditional ceramic substrate chip on board (COB) encapsulation mode. Research results show that heat-dissipation effect is better when the thickness of inert gas layer is 1.5 mm and the thermal resistance of dual channel heat-dissipation luminaire is far less than that of sin-gle channel. Comparing with traditional epoxy resin, plastic has the characteristics of high transmissivity, anti-aging and good anti-ultraviolet effect. The new encapsulation mode has widely application prospect in the market enviro-ment of widely development of UV LED luminaire with high power and intensive encapsulation.