粉末冶金材料科学与工程
粉末冶金材料科學與工程
분말야금재료과학여공정
POWDER METALLURGY MATERIALS SCIENCE AND ENGINEERING
2014年
4期
641-646
,共6页
王亚%李俊%杰斌%陈俊%陈江聪%李衡峰
王亞%李俊%傑斌%陳俊%陳江聰%李衡峰
왕아%리준%걸빈%진준%진강총%리형봉
聚酰胺酸%聚酰亚胺%银纳米粒子%化学亚胺化%性能表征
聚酰胺痠%聚酰亞胺%銀納米粒子%化學亞胺化%性能錶徵
취선알산%취선아알%은납미입자%화학아알화%성능표정
poly(amic acid)%polyimide%silver nanoparticles%chemical imidization%characterization
借助于PAA(poly(amide acid),聚酰胺酸)与Ag纳米粒子的相互作用以及PAA的线团构象,以原位合成的Ag/PAA纳米复合溶液为基础,采用低温化学亚胺化使PAA亚胺化,得到PI (polyimide,聚酰亚胺)原位包覆的银纳米粒子。采用透射电镜、同步热分析和阻抗分析等表征手段考察Ag/PI复合颗粒的形貌、热学性能和介电性能等。结果显示,Ag纳米粒子均匀地分散在PI基体中,高温处理不会使其发生显著的迁移和团聚;复合颗粒的界面极化效应较明显。本实验是第一次尝试采用全原位方式制备高含银量的 PI 纳米介电复合材料,研究结果可为Ag/PI高介电纳米复合材料的制备提供新的工艺参考。
藉助于PAA(poly(amide acid),聚酰胺痠)與Ag納米粒子的相互作用以及PAA的線糰構象,以原位閤成的Ag/PAA納米複閤溶液為基礎,採用低溫化學亞胺化使PAA亞胺化,得到PI (polyimide,聚酰亞胺)原位包覆的銀納米粒子。採用透射電鏡、同步熱分析和阻抗分析等錶徵手段攷察Ag/PI複閤顆粒的形貌、熱學性能和介電性能等。結果顯示,Ag納米粒子均勻地分散在PI基體中,高溫處理不會使其髮生顯著的遷移和糰聚;複閤顆粒的界麵極化效應較明顯。本實驗是第一次嘗試採用全原位方式製備高含銀量的 PI 納米介電複閤材料,研究結果可為Ag/PI高介電納米複閤材料的製備提供新的工藝參攷。
차조우PAA(poly(amide acid),취선알산)여Ag납미입자적상호작용이급PAA적선단구상,이원위합성적Ag/PAA납미복합용액위기출,채용저온화학아알화사PAA아알화,득도PI (polyimide,취선아알)원위포복적은납미입자。채용투사전경、동보열분석화조항분석등표정수단고찰Ag/PI복합과립적형모、열학성능화개전성능등。결과현시,Ag납미입자균균지분산재PI기체중,고온처리불회사기발생현저적천이화단취;복합과립적계면겁화효응교명현。본실험시제일차상시채용전원위방식제비고함은량적 PI 납미개전복합재료,연구결과가위Ag/PI고개전납미복합재료적제비제공신적공예삼고。
Due to macromolecular coil-like structure of PAA (poly(amide acid)) and the interaction between PAA molecules and silver nanoparticles, the Ag/PI (polyimide) composite nanoparticles were in-situ prepared by chemical imidization of Ag/PAA solution. The morphology, thermal and dielectric properties of Ag/PI composite particles were investigated by transmission electron microscope, thermal analysis, Fourier transform infrared spectroscopy, and so on. The results show that silver nanoparticles were disperse uniformly in the PI matrix without serious migration and agglomeration even after certain thermal treatment. There are obvious interfacial polarization responses in the Ag/PI nanocomposite systems. It is the first time to try an all-in-situ method to prepare highly silver-doped PI nanocomposites. This experiment may provide a reference for the fabrication of high-performance Ag/PI dielectric nanocomposites in the future.