IT时代周刊
IT時代週刊
IT시대주간
IT TIME WEEKLY
2014年
z2期
339-342
,共4页
MLCC%锡镀层%微观结构%氧化
MLCC%錫鍍層%微觀結構%氧化
MLCC%석도층%미관결구%양화
MLCC%tin-coating%microstructure%oxidation
通过采用扫描电子显微镜(SEM)分析MLCC锡镀层的微观结构，并用能谱仪(EDS)对其进行成分分析，找出MLCC端电极锡镀层的可焊性失效的主要原因：可焊性异常品的端电极表面锡镀层因氧化产生异常区域，导致元件的可焊性变差，并通过后期的可焊性实验验证了分析的结果，找出了端电极可焊性接失效的原因，并提出了应对该类不良的改进措施。
通過採用掃描電子顯微鏡(SEM)分析MLCC錫鍍層的微觀結構，併用能譜儀(EDS)對其進行成分分析，找齣MLCC耑電極錫鍍層的可銲性失效的主要原因：可銲性異常品的耑電極錶麵錫鍍層因氧化產生異常區域，導緻元件的可銲性變差，併通過後期的可銲性實驗驗證瞭分析的結果，找齣瞭耑電極可銲性接失效的原因，併提齣瞭應對該類不良的改進措施。
통과채용소묘전자현미경(SEM)분석MLCC석도층적미관결구，병용능보의(EDS)대기진행성분분석，조출MLCC단전겁석도층적가한성실효적주요원인：가한성이상품적단전겁표면석도층인양화산생이상구역，도치원건적가한성변차，병통과후기적가한성실험험증료분석적결과，조출료단전겁가한성접실효적원인，병제출료응대해류불량적개진조시。
By using SEM analysis of the microstructure of MLCC tin plating, and with EDS component of its analysis to identify the main reason for MLCC terminal electrode solderability of tin-plating failure. The welding failure modes occurred in the outer-electrode are demonstrated and the reason of failure are discussed. The results show that some abnormal regions on the tin-coating of samples with welding problem are produced by oxidation. The strict solder ability test has verified the results of the analysis and according to the analysis improved measures are suggested.
