CAJ | 학술논문

随着集成电路用晶圆向大尺寸化方向发展，国内10～15 cm硅抛光片市场竞争日益激烈，外延及器件厂家对抛光片的表面质量和可利用率要求越来越高。边缘亮线是一种存在于硅片抛光面边缘的腐蚀缺陷，对抛光片的成品率及后续工艺质量有重要影响。通过对硅片边缘表面形貌进行微观分析，揭示了“边缘亮线”产生的机理，分别研究了抛光工艺条件和倒角工艺条件对边缘缺陷的影响，通过优化抛光工艺条件，消除了抛光片表面“边缘亮线”缺陷。
수착집성전로용정원향대척촌화방향발전，국내10～15 cm규포광편시장경쟁일익격렬，외연급기건엄가대포광편적표면질량화가이용솔요구월래월고。변연량선시일충존재우규편포광면변연적부식결함，대포광편적성품솔급후속공예질량유중요영향。통과대규편변연표면형모진행미관분석，게시료“변연량선”산생적궤리，분별연구료포광공예조건화도각공예조건대변연결함적영향，통과우화포광공예조건，소제료포광편표면“변연량선”결함。
With the development of integrated circuit wafer to the large size, the domestic 10~15 cm silicon wafer market competition is becoming increasingly fierce, the epitaxy and the device manufacturers demand better surface quality and higher availability. Edge Bright Line is corrosion defects existing in the edge of polishing wafer surface, have an important influence on the polishing wafer yield and subsequent process quality. Through the micro analysis of the edge of the wafer surface, revealed the Edge Line mechanism, the influence of polishing process conditions and grinding process conditions on the edge defects were studied, by optimizing the polishing process conditions, eliminated the Edge Bright Line defects on polished wafers.