CAJ | 학술논문

随着LED应用的不断发展，LED大屏控制基板的贴片工艺成为了研究热点。通过模板优化、载板优化设计、二次回流等方面的实验，研究了LED大屏控制基板高密度贴片工艺过程中如何提高焊接可靠性的问题。实验结果表明，从模板开口设计、载板治具优化设计、二次回流焊接优化设计等三方面进行工艺改善，有效地提高了LED大屏控制基板的焊接可靠性，降低了产品不良率。
수착LED응용적불단발전，LED대병공제기판적첩편공예성위료연구열점。통과모판우화、재판우화설계、이차회류등방면적실험，연구료LED대병공제기판고밀도첩편공예과정중여하제고한접가고성적문제。실험결과표명，종모판개구설계、재판치구우화설계、이차회류한접우화설계등삼방면진행공예개선，유효지제고료LED대병공제기판적한접가고성，강저료산품불량솔。
With the development of LED applications, Surface Mounting Technology (SMT) of LED large screen control board has become the hot spot of research. The stencil optimization design, load board optimization design, step reflow and other aspects have been researched to improve the soldering reliability problems of SMT for high density LED large screen control substrates. The experimental results show that, the optimization proposes has improved the solder reliability of LED large screen control substrate, reduce product defective rate.