电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2014年
5期
258-263
,共6页
3D-plus%力学适应性%封装%可靠性
3D-plus%力學適應性%封裝%可靠性
3D-plus%역학괄응성%봉장%가고성
3D-plus%Mechanical properties%Package%Reliability
与传统的表面贴装器件相比，3D-plus封装形式的器件Z向尺寸较大、重心较高，影响器件的力学适应性。其特殊的封装工艺带来了引线搪锡、焊接及防护等诸多工艺困难。介绍了3D-plus封装器件的结构工艺特点。总结了该类器件电装全过程中的实施工艺。通过开展相关的工艺可靠性试验，证明在现有的工艺条件下采用目前的实施工艺能够满足产品的高可靠性实施要求。
與傳統的錶麵貼裝器件相比，3D-plus封裝形式的器件Z嚮呎吋較大、重心較高，影響器件的力學適應性。其特殊的封裝工藝帶來瞭引線搪錫、銲接及防護等諸多工藝睏難。介紹瞭3D-plus封裝器件的結構工藝特點。總結瞭該類器件電裝全過程中的實施工藝。通過開展相關的工藝可靠性試驗，證明在現有的工藝條件下採用目前的實施工藝能夠滿足產品的高可靠性實施要求。
여전통적표면첩장기건상비，3D-plus봉장형식적기건Z향척촌교대、중심교고，영향기건적역학괄응성。기특수적봉장공예대래료인선당석、한접급방호등제다공예곤난。개소료3D-plus봉장기건적결구공예특점。총결료해류기건전장전과정중적실시공예。통과개전상관적공예가고성시험，증명재현유적공예조건하채용목전적실시공예능구만족산품적고가고성실시요구。
Compared with conventional surface devices,3D-plus packing devices has larger package size in Z direction, and higher center gravity. These factors affect the mechanical properties of the device. Its special packaging technology has brought many difficulties including tin coating of lead,soldering and protection and so on. Describe the structure of 3D-plus package device. Summarize the assembly process. It is verified that the present technology can meet the requirement of high reliability product through the relevant reliability test.
