印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
9期
51-54
,共4页
焊盘划伤%飞针测试%抬针高度%移动速度
銲盤劃傷%飛針測試%抬針高度%移動速度
한반화상%비침측시%태침고도%이동속도
Bonding Pad Scratches%Flying Probe%Lift Needle Height%Movement Speed
从电路板的焊盘划伤问题入手，并对相应时间段的质量数据分析统计，初步确定发生电路板焊盘划伤主要是由于飞针的技术参数设置不合理造成。进一步试验验证并参阅相关资料，最终确定根据测试板厚来设置飞针的抬针高度及移动速度。并对改善后的效果进行了跟踪验证。
從電路闆的銲盤劃傷問題入手，併對相應時間段的質量數據分析統計，初步確定髮生電路闆銲盤劃傷主要是由于飛針的技術參數設置不閤理造成。進一步試驗驗證併參閱相關資料，最終確定根據測試闆厚來設置飛針的抬針高度及移動速度。併對改善後的效果進行瞭跟蹤驗證。
종전로판적한반화상문제입수，병대상응시간단적질량수거분석통계，초보학정발생전로판한반화상주요시유우비침적기술삼수설치불합리조성。진일보시험험증병삼열상관자료，최종학정근거측시판후래설치비침적태침고도급이동속도。병대개선후적효과진행료근종험증。
In this paper, from the bonding pad scratches problem of circuit board and statistical data analysis about the quality of the corresponding period, it preliminarily confirmed that PCB solder cut is the main reason caused by the technical parameters of fiying probe set unreasonably. Through the further test and by referring to the related information, it finally determined according to the testing of thickness of lift to set up the fiy needle height and movement speed. The effect of the improved results was tracked and verified.
