印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
9期
44-46
,共3页
0.1mm芯板%内层偏移%涨缩
0.1mm芯闆%內層偏移%漲縮
0.1mm심판%내층편이%창축
0.1mm Core Board%Inner Offset%Expansion and Contraction
随着多层电路板向高精度化与高密度化的发展，厚度为0.1 mm的内层芯板的需求不断增加。然而由于芯板本身特性，在加工过程中，容易发生层间偏移而导致短路或断路的风险。针对0.1mm内层芯板出现的内层偏移模式进行分析与改善，通过数据分析得出内偏的主要原因为芯板在层压过程中出现涨缩，并对加工过程制定底片补偿、打孔补偿等一系列措施，有效抑制了内偏问题的发生，降低了内层短路或断路的风险。
隨著多層電路闆嚮高精度化與高密度化的髮展，厚度為0.1 mm的內層芯闆的需求不斷增加。然而由于芯闆本身特性，在加工過程中，容易髮生層間偏移而導緻短路或斷路的風險。針對0.1mm內層芯闆齣現的內層偏移模式進行分析與改善，通過數據分析得齣內偏的主要原因為芯闆在層壓過程中齣現漲縮，併對加工過程製定底片補償、打孔補償等一繫列措施，有效抑製瞭內偏問題的髮生，降低瞭內層短路或斷路的風險。
수착다층전로판향고정도화여고밀도화적발전，후도위0.1 mm적내층심판적수구불단증가。연이유우심판본신특성，재가공과정중，용역발생층간편이이도치단로혹단로적풍험。침대0.1mm내층심판출현적내층편이모식진행분석여개선，통과수거분석득출내편적주요원인위심판재층압과정중출현창축，병대가공과정제정저편보상、타공보상등일계렬조시，유효억제료내편문제적발생，강저료내층단로혹단로적풍험。
With the multi-layer circuit board to high precision and high density, the demand for inner core plate of 0.1mm thickness increasing. However, because the core plate itself characteristic, in the process, it is prone to inter story drift and easy to cause the risk of short circuit or open circuit. Therefore, this paper made the inner offset mode in the 0.1mm core board analysis and improvement, through the analysis of the data obtained in the main reason of core board appears expansion during lamination, and formulated a series of measures of negative compensation, compensation of punching process, effectively inhibit the partial problem, reduce the quality risk product inner short circuit or short circuit.
