精密成形工程
精密成形工程
정밀성형공정
METAL FORMING TECHNOLOGY
2014年
5期
113-118,123
,共7页
顶镦%触点%厚度分布%预成形半锥角%摩擦因数
頂鐓%觸點%厚度分佈%預成形半錐角%摩抆因數
정대%촉점%후도분포%예성형반추각%마찰인수
upsetting%contact%thickness distribution%preforming half cone angle%friction coefficient
目的：解决继电器 Ag-Cu 复合触点顶镦成形后,Ag 层厚度分布不均的问题。方法通过数值模拟分析了其预成形和终成形过程中等效应变的分布,以及 Ag-Cu 界面形状的变化规律及影响因素,并在预成形形状和摩擦因数方面,提出了改善 Ag 层厚度均匀性的措施。结果预成形模具形状及工件与模具间的摩擦,对成形结果的影响很大。结论半锥角α取值居中时,终成形后易获得均匀的 Ag 层厚度分布；减小 Ag-上模间摩擦因数或增大 Cu-下模间摩擦因数,则有利于增加终成形后 Ag 层厚度分布的均匀性。
目的：解決繼電器 Ag-Cu 複閤觸點頂鐓成形後,Ag 層厚度分佈不均的問題。方法通過數值模擬分析瞭其預成形和終成形過程中等效應變的分佈,以及 Ag-Cu 界麵形狀的變化規律及影響因素,併在預成形形狀和摩抆因數方麵,提齣瞭改善 Ag 層厚度均勻性的措施。結果預成形模具形狀及工件與模具間的摩抆,對成形結果的影響很大。結論半錐角α取值居中時,終成形後易穫得均勻的 Ag 層厚度分佈；減小 Ag-上模間摩抆因數或增大 Cu-下模間摩抆因數,則有利于增加終成形後 Ag 層厚度分佈的均勻性。
목적：해결계전기 Ag-Cu 복합촉점정대성형후,Ag 층후도분포불균적문제。방법통과수치모의분석료기예성형화종성형과정중등효응변적분포,이급 Ag-Cu 계면형상적변화규률급영향인소,병재예성형형상화마찰인수방면,제출료개선 Ag 층후도균균성적조시。결과예성형모구형상급공건여모구간적마찰,대성형결과적영향흔대。결론반추각α취치거중시,종성형후역획득균균적 Ag 층후도분포；감소 Ag-상모간마찰인수혹증대 Cu-하모간마찰인수,칙유리우증가종성형후 Ag 층후도분포적균균성。
Objective To solve the uneven thickness distribution of the Ag layer for the upsetted Ag-Cu composite relay contact. Methods Numerical simulation was used to analyze the distribution of effective strain during the process of prefor-ming and final forming, and the change pattern of the shape of Ag-Cu interface and its influencing factors were also consid-ered. And then, some measures to improve the thickness uniformity of the Ag layer were proposed from the aspects of pre-form shape and friction coefficients. Results The preform die shape and the friction between the workpiece and its dies had a great influence on the forming results. Conclusion It is easy to obtain uniform thickness distribution of the Ag layer after final forming, when an intermediate value is taken for the half cone angle α. It’s beneficial to increase the uniformity of thickness distribution of the Ag layer, if the friction coefficient of Ag-upper die is increased or the friction coefficient of Cu-lower die is increased.
