CAJ | 학술논문

基于垂直腔面发射激光器( vertical cavity surface emitting laser, VCSEL)的同轴管壳封装等效电路模型,分析影响器件高频性能的封装寄生参量。结合量产要求,通过调节管壳的部分结构参数与介质材料的介电常数,提高器件频率响应。分析结果表明,优化设计后的器件高频性能得到显著提高。
기우수직강면발사격광기( vertical cavity surface emitting laser, VCSEL)적동축관각봉장등효전로모형,분석영향기건고빈성능적봉장기생삼량。결합양산요구,통과조절관각적부분결구삼수여개질재료적개전상수,제고기건빈솔향응。분석결과표명,우화설계후적기건고빈성능득도현저제고。
The high speed, low cost vertical cavity surface emitting laser ( VCSEL) is widely used in many fields such as the storage area network. According to the recent news release of the Fabre Channel Industry Association, the transmission rate of the fiber channel standard has reached 16 Gbit/s. Because of its low cost and suitability for mass production, through-hole ( TO) tube has been widely used in the VCSEL whose rate is less than 10 Gbit/s. Packaging is an important step to achieve the high-frequency performance for the VCSEL. Based on the equivalent circuit model of VCSEL coaxial package, this paper analyses some package parasitic parameters that can affect the high-frequency performances of devices. And to meet with the mass production requirements in factories, the device frequency response is optimized by adjusting parts of structure parameters and the relative permittivity of filling mate-rials. The results show that the high-frequency performances of devices are improved remarkably after the optimiza-tion design.