CAJ | 학술논문

目的：精确且高效地对印制电路板组件热力学模型进行修正。方法采用基于拉丁超立方抽样试验设计和 Speraman 等级相关系数计算公式的相关性分析方法，找出电子产品热仿真试验中对元器件表面温度值影响较大的输入参数，然后进一步分析得出输入与输出之间的函数关系。在此基础上给出印制电路板组件(PCBA)热力学模型修正的一般方法流程。最后利用该方法对某航空电子产品中一块 PCBA 的热力学模型进行修正。结果修正结果较精确且只调用2次有限元软件。结论该热模型修正方法具有较高的精确性和高效性，可推广用于工程实践。
목적：정학차고효지대인제전로판조건열역학모형진행수정。방법채용기우랍정초립방추양시험설계화 Speraman 등급상관계수계산공식적상관성분석방법，조출전자산품열방진시험중대원기건표면온도치영향교대적수입삼수，연후진일보분석득출수입여수출지간적함수관계。재차기출상급출인제전로판조건(PCBA)열역학모형수정적일반방법류정。최후이용해방법대모항공전자산품중일괴 PCBA 적열역학모형진행수정。결과수정결과교정학차지조용2차유한원연건。결론해열모형수정방법구유교고적정학성화고효성，가추엄용우공정실천。
Objective To update the thermodynamics model of the printed circuit board assembly accurately and effi-ciently. Methods The input parameters with great effects on the surface temperature of a component in the thermal simula-tion test were found out through the correlation analysis method which was based on the Latin hypercube sampling experi-ment design and the computational formula of Speraman rank correlation coefficient. And then the function relationship be-tween the input and output was obtained after further analysis. On this basis, the general process of the thermodynamics model updating of the printed circuit board assembly was provided. Finally, the thermodynamics model of a PCBA from an aircraft electronic product was updated with this method. Results The result of the updated model showed good accuracy and only two calls to finite element software. Conclusion This method of thermodynamics model updating had good accura-cy and efficiency, and could be used in engineering practice.