CAJ | 학술논문

利用Moldflow和Ansys对环氧树脂塑封过程进行模拟，并且用应力偏光仪获得应力条纹，然后与模拟结果进行对比。结果表明，环氧树脂热固性塑料在完成塑封后，其残余应力基本呈均匀分布。然而由于条带和塑封体热膨胀系数不同，在条带和塑封体接触部位会形成应力集中。并发现塑封体的残余应力和塑封体与条带接触部位的最大残余应力会随着保压压力的增大呈线性降低趋势。残余应力的降低不仅能够保证尺寸精度，而且塑封件在使用时还能减少塑封体与条带开裂的可能性。
이용Moldflow화Ansys대배양수지소봉과정진행모의，병차용응력편광의획득응력조문，연후여모의결과진행대비。결과표명，배양수지열고성소료재완성소봉후，기잔여응력기본정균균분포。연이유우조대화소봉체열팽창계수불동，재조대화소봉체접촉부위회형성응력집중。병발현소봉체적잔여응력화소봉체여조대접촉부위적최대잔여응력회수착보압압력적증대정선성강저추세。잔여응력적강저불부능구보증척촌정도，이차소봉건재사용시환능감소소봉체여조대개렬적가능성。
Moldflow and Ansys were used to simulate the process of epoxy resin encapsulation,moreover stress polariscope was used to get stress stripe and compare the simulation results. The results show that after the epoxy resin encapsulation is completed,the residual stress is equally distributed. However,due to the different heat expansion coefficient between the stripe and encapsulation body,the stress concentration is formed at the contact area of the stripe and encapsulation body. It is found that the residual stress of encapsulation body and the maximum residual stress of the contact area between the stripe and encapsulation body linearly decrease with the increase of the holding pressure. Residual stress reduction not only can guarantee the dimensional accuracy,but also can reduce the probability of cracking between stripe and encapsulation body in using.